830 Point Solderless Breadboard na aluminom backplate KLS1-BB830C

830 Point Solderless Breadboard na aluminom backplate KLS1-BB830C
  • obere-img

Biko budata ozi PDF:


pdf

Nkọwa ngwaahịa

Mkpado ngwaahịa

Onyonyo ngwaahịa

830 Point Solderless Breadboard na aluminom backplate 830 Point Solderless Breadboard na aluminom backplate 830 Point Solderless Breadboard na aluminom backplate

Ozi ngwaahịa

830 Point Breadboard etinyere na aluminom backplate.

  • Oghere ngwụcha: 830
  • ihe: ABS plastic
  • Edemede njikọ: 3
  • Akụkụ: 183 x105mm
  • Ọ bịara na-acha ọcha maka ọdịdị ahụ dị ọcha (ọ bụghị uzo)
  • 3 akwụkwọ mmado
  • 1 Terminal Strip, 630 Tie-point
  • 2 eriri nkesa, 200 Tie-point
  • Akụkụ bred 16.5 × 5.4 × 0.85 (cm)
  • Nchikota agba maka ntinye akụrụngwa dị mfe
  • Nabata nha waya dị iche iche (AWG:20-29)
  • Magburu onwe maka oru ngo DIY, prototyping na nnwale
  • Ozi ịtụ:
    KLS1-BB830C-01
    830: 830 isi
    Agba dị: Ọcha na nghọta

    1427355246

1427269085

 


  • Nke gara aga:
  • Osote: