Njikọ kaadị Micro SIM, 8P
Njikọ kaadị Micro SIM, 8P
Njikọ kaadị Micro SIM, 6P
P-H1.5-R )
Njikọ Kaadị Micro SIM;PUSH PUSH,6P+1P Ma ọ bụ 8P+1P,H1.50mm KLS1-SIM-090
Njikọ Kaadị Micro SIM;PUSH PUSH,6P Ma ọ bụ 6P+1P,H1.35mm KLS1-SIM-069
Ozi ngwaahịa Micro SIM Njikọ Kaadị;PUSH PUSH,6P Ma ọ bụ 6P+1P,H1.35mm,Enweghị post. Ihe: Insulator: High TemperatureThermoplastic,UL94V-0 Kọntaktị:Copper Alloy,Plated 50U"NiOverall Kpọtụrụ Au 1U Shell:SUS,Plated 50U" Ni N'ozuzu Plated 1u"Au Nhọrọ Kọntaktị Mpaghara Eletriki: Ugbu a Rating: 0.5A Max.0. Kpọtụrụ ACVsistance1. Mgbochi mkpuchi:1000M Min./500VDC Ebe iru mmiri dị nso:95% RH Ma...
Njikọ Kaadị Micro SIM 8P, PUSH PULL, H2.4mm KLS1-SIM-044-8P
Ozi ngwaahịa Micro SIM Card Connector 8P,PUSH PULL,H2.4mm Material:Base:Hi-Temp Thermoplastic,UL94V-0.Black. Kọntaktị data: Alloy ọla kọpa, edobere ọla edo. Shell: igwe anaghị agba nchara, ọla edo edo edo. Eletrik: Nguzogide kọntaktị:50mΩ nke a na-ahụkarị, 100Ω Max. Mgbochi mkpuchi:>1000MΩ/500V DC. 3.Solderability Vapor phase:215ºC.30sec.Max. IR feflow:250ºC.5sk.Max. Ịzụ ahịa akwụkwọ ntuziaka:370ºC.3sk.Max. Okpomọkụ na-arụ ọrụ: -45ºC~+105&o...
Njikọ Kaadị Micro SIM 6P, PUSH PULL, H2.4mm KLS1-SIM-044-6P
Ozi ngwaahịa Micro SIM Card Connector 6P,PUSH PULL,H2.4mm Ihe:Base:Hi-Temp Thermoplastic,UL94V-0.Black. Kọntaktị data: Alloy ọla kọpa, edobere ọla edo. Shell: igwe anaghị agba nchara, ọla edo edo edo. Eletrik: Nguzogide kọntaktị:50mΩ nke a na-ahụkarị, 100Ω Max. Mgbochi mkpuchi:>1000MΩ/500V DC. 3.Solderability Vapor phase:215ºC.30sec.Max. IR feflow:250ºC.5sk.Max. Ịzụ ahịa akwụkwọ ntuziaka:370ºC.3sk.Max. Okpomọkụ na-arụ ọrụ: -45ºC~+105&o...
Njikọ kaadị SIM; PUSH PUSH, 6P + 2P, H1.80mm, na post ma ọ bụ na-enweghị post. KLS1-SIM-110
Ozi Ngwaahịa Njikọ Kaadị SIM;PUSH PUSH,6P+2P,H1.80mm Na post ma ọ bụ na-enweghị post.Ihe onwunwe: Ụlọ ihe onwunwe: LCP UL94V-0Contact Material: Tin-BronzePackage: Tape na Reel Package Electrical Characteristics:Voltage rating: urrent.5. voltaji: 250V AC / 1 nkeji mkpuchi mkpuchi: ≥1000ΜΩ Nguzogide kọntaktị: ≤30mΩLife:
Njikọ kaadị SIM, PUSH PUSH, 8P+1P, H1.9mm, ya na KLS1-SIM-108
Ozi Ngwaahịa Njikọ Kaadị SIM,PUSH PUSH,8P+1P,H1.9mm,ya na Post Ihe: Ụlọ:Hi-Temp Plastic,UL94V-0.Rated. Kọntaktị: Alloy ọla kọpa. Shell: Alloy ọla kọpa. Ekwasa: Mpaghara ana-akpọ: Flash flash. Ebe nchekwa:80u"min, Matte tin alloy plated. N'okpuru efere:30u"min,Nickel. Shell: 30u" Min, Nickel plated n'ozuzu ebe nchekwa: Gole flash. Eletriki: ọkwa dị ugbu a: 0.5A. Ịnagide voltaji: AC500V rms mkpuchi mkpuchi: 1000MΩMin, na DC 500V ...
Njikọ kaadị SIM, PUSH PUSH, 6P+1P, H1.9mm, ya na KLS1-SIM-107
Ozi Ngwaahịa Njikọ Kaadị SIM,PUSH PUSH,6P+1P,H1.9mm,ya na Post Ihe: Ụlọ:Hi-Temp Plastic,UL94V-0.Rated. Kọntaktị: Alloy ọla kọpa. Shell: Alloy ọla kọpa / ígwè. Ekwasa: Mpaghara ana-akpọ: Flash flash. Ebe nchekwa:80u"min, Matte tin alloy plated. N'okpuru efere:30u"min,Nickel. Shell:30u" Min,Nickel plated n'ozuzu ebe nchekwa:Gole flash
Njikọ kaadị SIM;PUSH PUSH,6P,H1.85mm KLS1-SIM-106
Ozi Ngwaahịa Njikọ Kaadị SIM,PUSH PUSH,6P,H1.85mm,yana Post Housing:Hi-Temp Plastic,UL94V-0.Rated. Kọntaktị: Alloy ọla kọpa. Shell: SUS. Mecha: ọla edo edobere na mpaghara conatct, Tin plated na ọdụ ọdụ. Nkebi Mba. Nkọwa PCS/CTN GW(KG) CMB(m3) OrderQty. Usoro oge
Njikọ kaadị SIM, PUSH PUSH, 6P, H1.85mm, na-enweghị Post KLS1-SIM-087
Ozi Ngwaahịa Njikọ Kaadị SIM, PUSH PUSH, 6P, H1.85mm, na-enweghị Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Kọntaktị: Alloy ọla, T = 0.15mm Shell: igwe anaghị agba nchara, T = 0.15mm Finsh: Terminal: 50u" min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u"Nickel Underplated on Allover,Gold Flash on Solder Latch. Eletriki: Ntụle ugbu a:0.5A. Voltage Rating:5.0 Vrms. Mkpuchi na-eguzogide...
Njikọ kaadị SIM, PUSH PUSH, 6P + 2P, H1.85mm, na-enweghị Post KLS1-SIM-086
Ozi Ngwaahịa Njikọ Kaadị SIM,PUSH PUSH,6P+2P,H1.85mm,enweghị Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Kọntaktị: Alloy ọla kọpa, T = 0.15mm Shell: igwe anaghị agba nchara, T = 0.15mm Finsh: Terminal: 50u" min Nickel Underplated on Allover, GoldPlating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u"Nickel Underplated on Allover,Gold Flash on Solder Latch. Eletriki: Rating ugbu a:0.5A. Voltage Rating:5.0 Vrms. Mkpuchi mkpuchi...
Njikọ kaadị SIM, PUSH PUSH, 8P + 2P, H1.85mm, na-enweghị Post KLS1-SIM-085A
Ozi Ngwaahịa Njikọ Kaadị SIM,PUSH PUSH,8P+2P,H1.85mm,na-enweghị Post Material: Insulator:H-TemperaturePlastic,UL94V-0.Black. Kpọtụrụ: Alloy ọla, T = 0.15mm Shell: igwe anaghị agba nchara, T = 0.15mm Ngwunye: Terminal: 50u" min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u"Nickel Underplated on Allover,GoldFlash na Solder Latch. Eletriki: Rating ugbu a:0.5A. Voltage Rating:5.0 Vrms. Mkpuchi na-eguzogide...
Njikọ kaadị SIM, PUSH PUSH, 8P + 2P, H1.85mm, na-enweghị Post KLS1-SIM-085
Ozi Ngwaahịa Njikọ Kaadị SIM,PUSH PUSH,8P+2P,H1.85mm,enweghị Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Kọntaktị: Alloy ọla kọpa, T = 0.15mm Shell: igwe anaghị agba nchara, T = 0.15mm Finsh: Terminal: 50u" min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u"Nickel Underplated on Allover,GoldFlash on Solder Latch. Eletriki: Ugbu a Rating:0.5A. Voltage Rating:5.0 Vrms. Mkpuchi Resi...
Njikọ kaadị SIM, PUSH PUSH, 6P + 2P, H1.85mm, na-enweghị Post KLS1-SIM-084
Ozi Ngwaahịa Njikọ Kaadị SIM, PUSH PUSH, 6P + 2P, H1.85mm, na-enweghị Post ihe onwunwe: Housing: LCP, UL94V-0 Kpọtụrụ:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester.Operating okpomọkụ: -45º Kọntaktị Mpaghara ana-akpọtụrụ;Flash ọla edo edobere n'elu ọdụdụ, na kọntaktị zuru oke 50u" min Nickel. Shell:50u" min Nickel Underplated N'ozuzu, Flash ọla edo edobere na ọdụ ọdụ. Nkebi Mba. PC nkọwa...
Njikọ kaadị SIM, PUSH PUSH, 8P + 1P, H1.85mm, na-enweghị Post KLS1-SIM-074B
Ozi Ngwaahịa Njikọ Kaadị SIM, PUSH PUSH, 8P+1P, H1.85mm, na-enweghị Post Material: Housing: High Temperature Thermoplastic, UL94V-0.Black. Kọntaktị: Alloy ọla kọpa. Ihe mkpuchi: Kọntaktị: Alloys ọla ma ọ bụ ígwè. Ekwasa: Underplate:Nickel. Mpaghara kọntaktị: Gold karịrị Nickel. Mpaghara ihe na-ere ahịa: Tin Over Nickel. Shell:G/F Plate N'elu Nickel Na ọdụ ọdụ Eletriki: Ntụle dị ugbu a:0.5A. Ogo voltaji: 5.0 Vrm. Mgbochi Mgbochi: 500M Min.At DC 500V DC Iguzogide Voltaji: 250V A...
Njikọ kaadị SIM, PUSH PUSH, 8P+1P, H1.85mm, na-enweghị Post KLS1-SIM-074A
Ozi Ngwaahịa Njikọ Kaadị SIM,PUSH PUSH,8P+1P,H1.85mm,enweghị Post Material: Insulator:H-TemperaturePlastic,UL94V-0.Black. Kpọtụrụ: Alloy ọla, T = 0.15mm Shell: igwe anaghị agba nchara, T = 0.15mm Ngwunye: Terminal: 50u" min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u"Nickel Underplated on Allover,GoldFlash on Solder Latch. Eletriki: Ugbu a Rating:0.5A. Voltage Rating:5.0 Vrms. Mkpuchi Mgbochi...
Njikọ kaadị SIM, PUSH PUSH, 6P, H1.85mm, ya na Post na pụta KLS1-SIM-073A
Ozi Ngwaahịa Njikọ Kaadị SIM,PUSH PUSH,6P,H1.85mm,nwere Post na pụta Eletriki: Ọdịmma ugbu a:0.5A. Ogo voltaji: 5.0 Vrm. Mgbochi mkpuchi: 500M Min.At DC 500V DC Voltaji na-adịgide adịgide: 250V ACrms Maka 1 nkeji. Nguzogide kọntaktị: 100M Max.At 10MA/20mVMAX. Okpomọkụ Na-arụ ọrụ: -45ºC~+85ºCycles na-emegharị: 5000 Ntinye. Ihe: Insulator:H-Temperature Plastic,UL94V-0.Black. Kọntaktị: Alloy ọla, T = 0.15mm Shell: igwe anaghị agba nchara, T = 0.15 ...
Njikọ kaadị SIM, PUSH PUSH, 6P + 2P, H1.85mm, na-enweghị Post KLS1-SIM-064A
Ozi Ngwaahịa Njikọ Kaadị SIM,PUSH PUSH,6P+2P,H1.85mm,enweghị Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Kpọtụrụ: Alloy ọla, T = 0.15mm Shell: igwe anaghị agba nchara, T = 0.15mm Ngwunye: Terminal: 50u" min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u"Nickel Underplated on Allover,Gold Flashon Solder Latch. Eletriki: Rating ugbu a:0.5A. Voltage Rating:5.0 Vrms. Mkpuchi na-eguzogide...
Njikọ kaadị SIM, PUSH PUSH, 6P + 2P, H1.80mm, na-enweghị Post KLS1-SIM-030C
Ozi Ngwaahịa Njikọ Kaadị SIM, PUSH PUSH, 6P + 2P, H1.80mm, na-enweghị Post Material: Housing: LCP, UL94V-0 Kpọtụrụ:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester. Mechaa: Kpọtụrụ: Ọlaedo Flash Plated Na Mpaghara kọntaktị;Ọlaedo Flash Plated Na SolderTails,Na kọntaktị zuru ezu Underplated 50u" min Nickel. Shell:50u" min Nickel Underplated N'ozuzu, GoldFlash Plated On Solder Tails. Okpomọkụ na-arụ ọrụ: -45ºC~+85ºC Nkebi Mba. Description ...
Njikọ kaadị SIM, PUSH PUSH, 6P + 2P, H1.85mm, ya na KLS1-SIM-030D
Ozi Ngwaahịa Njikọ Kaadị SIM, PUSH PUSH, 6P + 2P, H1.85mm, na Post Ihe: Insulator:H-Temperature Plastic,UL94V-0.Black. Kọntaktị: Alloy ọla kọpa, T = 0.15mm; Shell: igwe anaghị agba nchara, T = 0.15mm Finsh: Terminal: 50u" min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u"Nickel Underplated on Allover,Gold Flash on Solder Latch. Eletriki: Rating ugbu a:0.5AVoltage Rating:5.0 Vrms. Mkpuchi Mgbochi...
Njikọ kaadị SIM, PUSH PUSH, 6P + 2P, H1.85mm, ya na KLS1-SIM-030F
Ozi Ngwaahịa Njikọ Kaadị SIM, PUSH PUSH, 6P + 2P, H1.85mm, na Post Ihe: Insulator:H-Temperature Plastic,UL94V-0.Black. Kọntaktị: Alloy ọla kọpa, T = 0.15mm; Shell: igwe anaghị agba nchara, T = 0.15mm Finsh: Terminal: 50u" min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u"Nickel Underplated on Allover,Gold Flash on Solder Latch. Eletriki: Rating ugbu a:0.5AVoltage Rating:5.0 Vrms. Mkpuchi Mgbochi...
Njikọ kaadị SIM, PUSH PUSH, 6P, H1.85mm, na-enweghị Post KLS1-SIM-030E
Ozi Ngwaahịa Njikọ Kaadị SIM,PUSH PUSH,6P,H1.85mm,enweghị Post ihe onwunwe: Ụlọ:Hi-Temp Plastic,UL94V-0.Rated. Kọntaktị: Alloy ọla kọpa. Shell: igwe anaghị agba nchara.SUS 301,T=0.20mm. Plating: Mpaghara ana-akpọ:G/F Plated over 30u" Nickel Solder area:80u" Tin Plated over 30u" Nickel. N'okpuru efere:30u" Min nickel. Shell:30u" Min,Nickel Plated Over All,SolderArea:Gold Flash. Eletriki: Rating ugbu a:0.5 A Dielectric na-eguzogide voltaji:250...- English
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