Micro SD kaadị njikọ Hinged Ụdị, H1.9mm KLS1-TF-017
Ihe oyiyi ngwaahịa ngwaahịa Micro SD kaadị njikọ Hinged Ụdị,H1.9mm Ihe: Insulator:Elu okpomọkụ Thermoplastic Flammability Raring,UL94V-0,Black. Kọntaktị: Copper Alloys Cover:Stainless Steel Contact Area Plating:Gold voer Ni Solder Tail Coplanarity Ga-N'ime 0.10MAX.
Micro SD kaadị njikọ push push, H1.4mm, na CD pin KLS1-TF-016
Product Images Product Ozi Micro SD kaadị njikọ push push,H1.4mm, with CD pin Notes: 1.Coplanarity spec.for all solder toll and solder pad is 0.10mm 2.Electric characters: 2-1.Current Rating:0.5 Amp.max. 2-2.Voltaji:100V DC max. 2-3.Low larịị conatct mgbochi: 100mΩ Max. 2-4.Dielectric na-eguzogide voltaji: AC500V rms. 2-5. Nguzogide mkpuchi: 1000MΩ Min. (Ikpeazụ) 100MΩ Min. 3.Mechanical njirimara: 3-1.Durability: 5000 Cycles. 3-2.Okpomọkụ Na-arụ ọrụ: -45ºC~+105ºC ...
Micro SD kaadị njikọ push pull,H1.42mm, na CD pin KLS1-TF-015
Product Images Product Ozi Micro SD kaadị njikọ push pull,H1.42mm, with CD pin Ihe: Metal shei: igwe anaghị agba nchara, Nickel n'ozuzu 50u "Housing:Liouid crystal polymer,UL94V-0, Black. kọntaktị ọnụ:Phosphor Bronze.Contact:Gold flash;Solder Tail:Gold.1u" Chọpụta ọnụ:Phosphor Bronze.Contact:Gold flash;Solder Tail:Gold 1u" Min. Switch Terminal:Phosphor Bronze.Contact:Gold flash;Solder Tail:Gold 1u" Min.
Micro SD kaadị njikọ push pull,H1.8mm KLS1-TF-014
Ihe oyiyi ngwaahịa ngwaahịa Micro SD kaadị njikọ push pull, Height 1.8mm, Roll Pack. Ihe onwunwe: Ụlọ: LCP, UL94V-0, Black. Ọnụ: Alloy ọla kọpa, Ọlaedo nke ahọpụtara na mpaghara mmekọ. Shell: Igwe eletriki igwe: Ogo voltaji: 5V Ogo dị ugbu a: 0.5 A Max. Nguzogide kọntaktị: 100mΩ Max. Mgbochi mkpuchi:1000MΩ Min. Voltaji na-eguzogide: 500V 1 nkeji. Ogologo oge: 10000 okirikiri.
Micro SD kaadị njikọ push push, H1.4mm, na CD pin KLS1-TF-012
Ngwaahịa Ozi Ngwaahịa Micro SD kaadị njikọ push push,H1.4mm,na CD pin Ihe: Insulator:High okpomọkụ Thermoplastic,UL94V-0. Ọnụ: Alloy ọla kọpa, Plated 50u" Ni N'ozuzu. Plated Au Selective Contact Area Plated 100u" Sn Over Ni On Solder Area. Shell: Plated 50u"Ni N'ozuzu. Plated Au Selective Contact Area Electrical: Ugbu a Rating:0.5 A AC/DC max. Voltage Rating:125V AC/DC Ambient iru mmiri Range:95% RH Max. Kpọtụrụ Nguzogide:100mΩ Max. Ins...
Njikọ Kaadị Micro SD; Ụdị nkuchi, H1.5mm & H1.8mm KLS1-TF-007
Ihe onyonyo ngwaahịa ngwaahịa Micro SD Njikọ Kaadị; Ụdị Hinged,H1.5mm & H1.8mm Ihe: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Terminal:Ọla kọpa Alloy.AU Plating na mpaghara kọntaktị ọnụ niile, yana plating tin na mpaghara ọdụ ọdụ. Shell: igwe anaghị agba nchara. Eletriki: Ntụle ugbu a: 0.5 A Voltage Rating: 5.0 vrms Mkpuchi Mgbochi: 1000MΩ Min./500V DC Ịkwụsị Voltaji: 250V AC Maka nkeji 1. Nkwụsị kọntaktị: 100mΩ Max.AT 10mA/20mV Oke arụ ọrụ: -45ºC~...
Mid Mount Micro SD kaadị njikọ push push,H1.8mm,mikpu na CD pin KLS1-TF-003E
Ngwaahịa Ozi Ngwaahịa n'etiti ugwu Micro SD kaadị njikọ push push,H1.8mm,mikpu na CD pin Ihe: Housing:High okpomọkụ Thermoplastic,UL94V-0,Black. Ọnụ: Alloy ọla kọpa . Shell: igwe anaghị agba nchara. Kọntaktị: Mpaghara Kọntaktị:Au G/F, Mpaghara solder: Matte tin 80u” Min; N'okpuru efere Ni 30u” Min niile. CD Pin: Mpaghara kọntaktị: Au G/F, N'okpuru efere Ni 30u" Min niile. Eletriki: akwadoro ugbu a: 1.0 A gosiri voltaji: 30V Kpọtụrụ Resistance50mΩ Max. Mkpuchi Mgbochi:100...
Micro SD kaadị njikọ push push, H1.85mm, na CD pin KLS1-TF-003D
Ngwaahịa Ozi Ngwaahịa Micro SD kaadị njikọ push push,H1.85mm,yana CD pin Ihe: Insulator:Elu okpomọkụ Thermoplastic,LCP,UL94V-0. Kọntaktị:Ọla kọpa Alloy T=0.15,Plated 50u”Ni Overall.Plated Au Selective Contact Area Plated 30u”-70u”Sn Over Ni On Solder Area.Shell:T=0.15,Plated 30u”Ni N'ozuzu min. Plated 0.5u” Au Selective ContactArea Eletriki: Rating ugbu a:0.5mA amx. Voltage Rating:3.3V Ambient iru mmiri Range:95% RH Max. Co...
Micro SD kaadị njikọ push push, H1.85mm, na CD pin, GOLD KLS1-TF-003C
Ngwaahịa Ozi Ngwaahịa Micro SD kaadị njikọ push push,H1.85mm,yana CD pin,Ọlaedo Ihe: Insulator:Elu okpomọkụ Thermoplastic,LCP,UL94V-0. Kọntaktị:Ọla kọpa Alloy T=0.15,Plated 50u”Ni Overall.Plated Au Selective Contact Area Plated 30u”-70u”Sn Over Ni On Solder Area.Shell:T=0.15,Plated 30u”Ni N'ozuzu min. Plated 0.5u” Au Selective kọntaktị Mpaghara
Mid Mount Micro SD kaadị njikọ push push, H1.8mm, na CD pin KLS1-TF-003A
Ngwaahịa Ozi Ngwaahịa n'etiti ugwu Micro SD kaadị njikọ push push,H1.8mm,yana CD pin Ihe: Insulator:High okpomọkụ Thermoplastic,UL94V-0. Kọntaktị: Alloy ọla kọpa, Plated 50u” Ni N'ozuzu. Plated Au Selective Contact Area Plated 100u” Sn Over Ni On Solder Area. Shell: Plated 50u" Ni N'ozuzu. Plated 1u" Au Nhọrọ kọntaktị Mpaghara. Eletriki: Ọkwa dị ugbu a: 0.5mA AC/DC amx. Ogo voltaji:125V AC/DC iru iru mmiri:95% RH Max. Kpọtụrụ Resi...
Ihe nkwụnye kaadị Micro SD kaadi, H1.85mm, ya na pin CD KLS1-TF-003
Ngwaahịa Ozi Ngwaahịa Micro SD kaadị njikọ push push,H1.85mm,yana CD pin Ihe: Insulator:Elu okpomọkụ Thermoplastic,UL94V-0. Kọntaktị:Ọla kọpa Alloy T=0.15,Plated 50u”Ni Overall.Plated Au Selective Contact Area Plated 30u”-70u”Sn Over Ni On Solder Area.Shell:T=0.15,Plated 30u”Ni N'ozuzu min. Plated 0.5u” Au Nhọrọ Ndị Ana-akpọ Eletriki: Ọdịnaya dị ugbu a:0.5 Ogo voltaji:3.3V Oke iru mmiri:95% RH Max. Kpọtụrụ Re...
Njikọ Kaadị Micro SD; Ụdị nkuchi, H1.9mm KLS1-TF-002
Ihe onyonyo Ngwaahịa Ngwaahịa Njikọ Kaadị Micro SD; Ụdị Hinged, H1.9mm Ihe: Ihe eji eme ụlọ: LCP UL94V-0 Ngwa kọntaktị: Ngwungwu Tin-Bronze: Tepu na Reel Package Electric Characteristics: Voltage Rating: 100V AC ugbu a Rating: 0.5V / AC1 na-eguzogide: 0.5V / AC1 na-eguzogide 0. ≥1000ΜΩ Nguzogide kọntaktị: ≤30MΩ Ndụ: 5000 okirikiri arụ ọrụ okpomọkụ: -45ºC ~+105ºC
Micro SD kaadị njikọ push push,H1.85mm, KLS1-TF-001B na-emechikarị
Ngwaahịa Ozi Ngwaahịa Micro SD kaadị njikọ push push,H1.85mm,emekarị mechiri emechi ihe: Housing: LCP,UL94V-0, Black. Kọntaktị: Phosphor Bronze. Akụkụ: SUS304. Eletrik: Nguzogide kọntaktị:100mΩ Kacha. Dielectric Voltaji na-eguzogide: 500V AC Max na nkeji 1. Mgbochi mkpuchi:1000MΩ Min. Ogo dị ugbu a: 0.5mA AC/DC max. Oke voltaji: 100V RMS Min. Ike mmekọ: 13.8N Max. Ike na-adịghị agbanwe agbanwe: 13.8N Min. Ndị agha na-emegide kọntaktị: 100g Min.Per Pin. Okpomọkụ na-arụ ọrụ: -45ºC~+...
Micro SD kaadị njikọ push push,H1.85mm, KLS1-TF-001 na-emechikarị
Ngwaahịa Ozi Ngwaahịa Micro SD kaadị njikọ push push,H1.85mm,emekarị mechiri emechi ihe: Housing: High okpomọkụ Thermoplastic,UL94V-0, Black. Kọntaktị: Alloy ọla kọpa . Shell: igwe anaghị agba nchara, Nickel. Lever: igwe anaghị agba nchara, Nickel. Mmiri: Pianowire, Nickle. Ekwasa: Underplate:Nickel. Mpaghara ana-akpọ: Gold karịrị Nickel. Ebe a na-ere ere: Tin over nickel.
Njikọ kaadị SIM okpukpu abụọ, PUSH PULL, H3.0mm KLS1-SIM2-002A
Ozi Ngwaahịa Ngwaahịa Njikọ Kaadị SIM okpukpu abụọ,PUSH PULL,H3.0mm Ihe: Housing:Hi-TEMP Plastic,UL94V-0.Black. Ọnụ: Ọla kọpa Alloy Shell: Igwe anaghị agba nchara ngwucha: Terminal: Au Plated na kọntaktị ebe, Matte tin plated na solder ọdụ underplated n'elu nickel Shell: Au Plated na solder ọdụ underplated n'elu nickel Eletriki: Kpọtụrụ Nguzogide: 50mΩ Max Ịnagide Voltage: 350V ACΩ 0M 0 ACΩ Ω Ω Ω ...
2 N'ime 1 Micro SIM & Njikọ Kaadị SD, 8P, H2.26mm KLS1-SIM-109
Ihe onyonyo ngwaahịa ngwaahịa 2 Na 1 Micro SIM & Njikọ Kaadị SD, 8P, H2.26mm Ihe: Insulator: High Temp Thermoplastic, UL94V-0.Black. Ọnụ: Alloy ọla, ọla edo na mpaghara kọntaktị 1u”, Ebe a na-ere ahịa gilding 1u” Upper Shell: Igwe anaghị agba nchara, Plate Nickel 50u”. Ala Shell:SUS304 R-1/2H T=0.10mm, Plate Nickel 50u”. Eletriki: Ike ntinye 1kgf Max.Iwepu ike 0.1kgf Min. Ogologo oge: okirikiri SIM 5000, nguzogide kọntaktị: Tupu ịnwale 80mΩ Max, mgbe...
Njikọ kaadị SIM okpukpu abụọ, PUSH PULL, H3.0mm KLS1-SIM-033
Ozi Ngwaahịa Ngwaahịa Njikọ Kaadị SIM Ugboro abụọ,PUSH PULL,H3.0mm Ihe: Housing:Hi-Temperature Plastic,UL94V-0.Black. Ọnụ:Ọla kọpa Alloy.Gold Flash Plated On All Terminal,AND 50u" Min Nickel Underplated On Allover Shell:Stainless Steel.50u"Nickel Underplated On Allover,Gold Flash On Solder PAD. Eletrik: Ọkwa dị ugbu a: 0.5 A. Ogo voltaji: 5.0 vrms. Mgbochi mkpuchi:1000MΩ Min.At DC500V DC. Voltaji na-adịgide adịgide: 250V AC RMS Maka 1 nkeji. Kpọtụrụ...
2 Na 1 SIM Kaadị + Micro SD Njikọ, PUSH PULL, H2.7mm KLS1-SIM-024
Ozi Ngwaahịa Ngwaahịa 2 na 1 SIM Kaadị + Micro SD Njikọ, PUSH PULL,H2.7mm Eletriki: Voltaji:100V AC Ugbu a:0.5A Max. Nguzogide kọntaktị: 100mΩ Max. Dielectric Voltaji na-eguzogide: 500V AC. Mgbochi mkpuchi:1000MΩ Min Mechanical: Ike ntinye kaadị:13.8N Max. Push na Ike:19.6N Max. Ogologo oge: 10000 okirikiri. Okpomọkụ Na-arụ ọrụ: -45ºC~+85ºC Eletriki: Voltaji:100V AC Ugbu a:0.5A Max. Nguzogide kọntaktị: 100mΩ Max. Dielectric na-eguzogide...
Njikọ Kaadị Nano SIM; PUSH PULL, 6Pin, H1.40mm KLS1-SIM-113
Ozi Ngwaahịa Ngwaahịa Nano Njikọ Kaadị SIM;PUSH PULL,6Pin,H1.40mm Ihe: Insulator:LCP,UL94V-0. Kpọtụrụ:C5210.Plated 50u” Ni N'ozuzu,Kpọtụrụ All Au 1u. Shell:SUS, Plated 50u” Ni N'ozuzu,PAD Au 1u. Eletriki: Ọkwa dị ugbu a: 0.5A AC/DC max. Ogo voltaji:30V AC/DC Nguzogide kọntaktị:30mΩ Kacha. Mgbochi mkpuchi: 1000MΩ Min na-arụ ọrụ okpomọkụ: -45ºC~+85ºC
Njikọ Kaadị Nano SIM, PUSH PUSH, 6Pin, H1.37mm, yana CD Pin KLS1-SIM-066
Ozi Ngwaahịa Ngwaahịa Nano Njikọ Kaadị SIM Nano, PUSH PUSH, 6Pin, H1.37mm,yana ihe CD Pin: Insulator:Elu okpomọkụ Thermoplastic,UL94V-0. Kọntaktị: Alloy ọla kọpa, Plated 50u” Ni Overall, PAD Au 1u”. Shell:SUS.All Ni 30U/MIN. Eletriki: Ọkwa dị ugbu a:0.5A amperes Voltage Rating:5V AC/DC Nguzogide kọntaktị:100mΩ Max. Mgbochi mkpuchi:1000MΩ Min./500V DC Na-arụ ọrụ okpomọkụ: -45ºC~+85ºC
Njikọ Kaadị Nano SIM, PUSH PUSH, 6Pin, H1.25mm, yana CD Pin KLS1-SIM-103
Ozi Ngwaahịa Ngwaahịa Nano Njikọ Kaadị SIM,PUSH PUSH,6Pin,H1.25mm,yana ihe CD pin: Kọntaktị:Copper Alloy.Au over Ni. Ebe obibi: Igwe juru LCP. Shell:Stainless.Au n'elu Ni.GND Frame:Copper Alloy.Au n'elu Ni. Ngbanwe nchọpụta:Ọla kọpa Alloy.Au n'elu Ni.Slide:Glass jupụtara Pa10t. Mmiri: igwe anaghị agba nchara. nko: igwe anaghị agba nchara. Eletrik: Egotara ugbu a:0.5A Oke oke voltaji:30V AC Nguzogide kọntaktị:100mΩ Kacha. Mgbochi Mgbochi:1000MΩ Min./500VDC Dielectric Na-eguzogide Voltaji:500...
Njikọ Kaadị Nano SIM, Ụdị tray, 6Pin, H1.55mm, na CD Pin KLS1-SIM-104
Ozi Ngwaahịa Ngwaahịa Nano Njikọ Kaadị SIM Nano, Ụdị tray, 6Pin,H1.55mm,yana CD Pin Eletriki: Rating ugbu a:1 Amp/Pin.MAX. Voltaji:30V DC.MAX Nguzogide kọntaktị dị ala:30mΩ Kachasị.Na mbụ. Dielectric Voltaji na-eguzogide: 500V AC MIN. Maka 1 nkeji. Nguzogide mkpuchi:100MΩ Min.500V DC .Maka otu nkeji. Ogologo oge: 1500 okirikiri. Okpomọkụ na-arụ ọrụ: -45ºC~+85ºC
Njikọ Kaadị Nano SIM, Ụdị tray, 6Pin, H1.5mm, na CD Pin KLS1-SIM-102
Ozi Ngwaahịa Ngwaahịa Nano Njikọ Kaadị SIM Nano, Ụdị tray, 6Pin,H1.5mm,yana CD Pin Eletriki: Rating ugbu a:1 Amp/Pin.MAX. Voltaji:30V DC.MAX Nguzogide kọntaktị dị ala:30mΩ Kachasị.Na mbụ. Dielectric Voltaji na-eguzogide: 500V AC MIN. Maka 1 nkeji. Nguzogide mkpuchi:100MΩ Min.500V DC .Maka otu nkeji. Ogologo oge: 1000 okirikiri. Okpomọkụ na-arụ ọrụ: -45ºC~+85ºC
Njikọ Kaadị Nano SIM; MID Mount Tray ụdị, 6Pin, H1.5mm, ya na CD Pin KLS1-SIM-100
Ihe onyonyo ngwaahịa ngwaahịa Nano Njikọ Kaadị SIM;MID Mount Tray ụdị,6Pin,H1.5mm,ya na CD Pin Material: Plastics:LCP,UL94V-0.Black. Kpọtụrụ:C5210 Shell:SUS304 Tray:LCP,UL94V-0.Black. Plating: Contact:Contact Area:G/F Plating;Soldertail Area:80u” Matte Tin Shell:Plating over 30u”Ni Solderable 30u”Ni Plating over all.Contact and tail coplanarity to be 0.10mm all.- English
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