Njikọ kaadị Micro SD HINGED TYPE,H1.9mm KLS1-TF-017
Ozi ngwaahịa Micro SD kaadị njikọ HINGED TYPE,H1.9mm Ihe: Insulator:Elu okpomọkụ Thermoplastic Flammability Raring,UL94V-0,Black. Kọntaktị: Copper Alloys Cover:Stainless Steel Contact Area Plating:Gold voer Ni Solder Tail Coplanarity Ga-N'ime 0.10MAX. Nkebi Mba. Nkọwa PCS/CTN GW(KG) CMB(m3) OrderQty. Usoro oge
Micro SD kaadị njikọ push push, H1.4mm, na CD pin KLS1-TF-016
Product Ozi Micro SD kaadị njikọ push push,H1.4mm, with CD pin Notes: 1.Coplanarity spec.for all solder toll and solder pad is 0.10mm 2.Electric characters: 2-1.Current Rating:0.5 Amp.max. 2-2.Voltaji:100V DC max. 2-3.Low larịị conatct mgbochi: 100mΩ Max. 2-4.Dielectric na-eguzogide voltaji: AC500V rms. 2-5. Nguzogide mkpuchi: 1000MΩ Min. (Ikpeazụ) 100MΩ Min. 3.Mechanical njirimara: 3-1.Durability: 5000 Cycles. 3-2.Operatin...
Micro SD kaadị njikọ push pull,H1.42mm, na CD pin KLS1-TF-015
Ngwaahịa Micro SD kaadị njikọ push pull,H1.42mm, na CD pin Ihe: metal shei: igwe anaghị agba nchara,Nickel n'ozuzu 50u" Ụlọ:Liouid crystal polymer, UL94V-0
Micro SD kaadị njikọ enweghị push, H1.8mm KLS1-TF-014
Ozi ngwaahịa Micro SD kaadị njikọ enweghị push,H1.8mm Ihe: Housing: LCP, UL94V-0, Black. Ọnụ: Alloy ọla kọpa, Ọlaedo nke ahọpụtara na mpaghara mmekọ. Shell: Igwe eletriki igwe: Ogo voltaji: 5V Ogo dị ugbu a: 0.5 A Max. Nguzogide kọntaktị: 100mΩ Max. Mgbochi mkpuchi:1000MΩ Min. Voltaji na-eguzogide: 500V 1 nkeji. Ogologo oge: 10000 okirikiri. Nkebi Mba. Nkọwa PCS/CTN GW(KG) CMB(m3) OrderQty. Usoro oge
Micro SD kaadị njikọ push push, H1.4mm, na CD pin KLS1-TF-012
Ozi ngwaahịa Micro SD kaadị njikọ push push,H1.4mm,na CD pin Ihe: Insulator:High okpomọkụ Thermoplastic,UL94V-0. Ọnụ: Alloy ọla, Plated 50u" Ni N'ozuzu. Plated Au Selective Contact Area Plated 100u" Sn Over Ni On Selder Area. Shell: Plated 50u"Ni N'ozuzu. Plated Au Selective Contact Area Electrical: Ugbu a Rating:0.5 A AC/DC max. Voltage Rating:125V AC/DC Ambient iru mmiri Range:95% RH Max. Kpọtụrụ Resistance:100m&Om...
Oghere kaadị Micro SD; Ụdị HINGED,H1.5mm & H1.8mm KLS1-TF-007
Ozi ngwaahịa Micro SD Card CONN;HINGED TYPE,H1.5mm & H1.8mm Ihe: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Terminal:Ọla kọpa Alloy.AU Plating na mpaghara kọntaktị ọnụ niile, yana plating tin na mpaghara ọdụ ọdụ. Shell: igwe anaghị agba nchara. Eletriki: Ntụle ugbu a: 0.5 A Voltage Rating: 5.0 vrms Mkpuchi Mgbochi: 1000MΩ Min./500V DC Ịkwụsị Voltaji: 250V AC Maka nkeji 1. Nguzogide kọntaktị:100mΩ Max.AT 10mA/20mV Max na-arụ ọrụ Te...
Mid Mount Micro SD kaadị njikọ push push,H1.0mm,mikpu na CD pin KLS1-TF-003E
Ozi ngwaahịa Mid Mount Micro SD kaadị njikọ push push,H1.0mm,mikpu na CD pin Ihe: Ụlọ:Elu okpomọkụ Thermoplastic,UL94V-0
Micro SD kaadị njikọ push push, H1.85mm, na CD pin KLS1-TF-003D
Ozi ngwaahịa Micro SD kaadị njikọ push push,H1.85mm,ya na CD pin Ihe: Insulator:High okpomọkụ Thermoplastic,LCP,UL94V-0. Kọntaktị: Ọla kọpa Alloy T = 0.15, Plated 50u"Ni N'ozuzu. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell:T=0.15,Plated 30u"Ni N'ozuzu min. Plated 0.5u" Au Selective ContactArea Eletriki: Rating ugbu a: 0.5mA amx. Voltage Rating: 3.3V Ambient iru mmiri Range: 95% RH Ma...
Micro SD kaadị njikọ push push, H1.85mm, na CD pin, GOLD KLS1-TF-003C
Ngwaahịa Micro SD kaadị njikọ push push,H1.85mm,na CD pin,Ọlaedo ihe: Insulator:High okpomọkụ Thermoplastic,LCP,UL94V-0. Kọntaktị: Ọla kọpa Alloy T = 0.15, Plated 50u"Ni N'ozuzu. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell:T=0.15,Plated 30u"Ni N'ozuzu min. Plated 0.5u" Au Nhọrọ kọntaktị Mpaghara
Mid Mount Micro SD kaadị njikọ push push, H1.0mm, na CD pin KLS1-TF-003A
Ngwaahịa Ozi Mid Mount Micro SD kaadị njikọ push push,H1.0mm,yana CD pin Ihe: Insulator:High okpomọkụ Thermoplastic,UL94V-0. Kọntaktị: Alloy ọla kọpa, Plated 50u" Ni N'ozuzu. Plated Au Selective Contact Area Plated 100u" Sn Over Ni On Solder Area. Shell:Pated 50u"Ni N'ozuzu ya. Plated 1u" Au Nhọrọ kọntaktị Mpaghara. Eletriki: Ọkwa dị ugbu a: 0.5mA AC/DC amx. Ogo voltaji:125V AC/DC iru iru mmiri:95% RH Max. Kpọtụrụ...
Ihe nkwụnye kaadị Micro SD kaadi, H1.85mm, ya na pin CD KLS1-TF-003
Ozi ngwaahịa Micro SD kaadị njikọ push push,H1.85mm,na CD pin Ihe: Insulator:High okpomọkụ Thermoplastic,UL94V-0. Kọntaktị: Ọla kọpa Alloy T = 0.15, Plated 50u"Ni N'ozuzu. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell:T=0.15,Plated 30u"Ni N'ozuzu min. Efere 0.5u" Au Nhọrọ Nhọrọ Eletriki: Ọkwa dị ugbu a: 0.5 Ogo voltaji:3.3V Oke iru mmiri: 95% RH Max. Conta...
Njikọ Kaadị Micro SD; Ụdị HINGED, H1.9mm KLS1-TF-002
Ozi ngwaahịa 1.1mmTF Njikọ Kaadị Ihe: Ihe eji eme ụlọ: LCP UL94V-0Contact Material: Tin-BronzePackage: Tepu na Reel Package Electrical Characteristics: Voltage Rating: 100VAC Ugbu a Rating: 0.5A (MaxWithWith20V Voltage: Voltage Voltage: 0.5A) ≥1000ΜΩ Nguzogide kọntaktị: ≤30MΩ Ndụ:
Micro SD kaadị njikọ push push,H1.85mm, KLS1-TF-001B na-emechikarị
Ozi ngwaahịa Micro SD kaadị njikọ push push,H1.85mm,A na-emekarị mechiri emechi ihe: Housing:LCP,UL94V-0
Micro SD kaadị njikọ push push,H1.85mm, KLS1-TF-001 na-emechikarị
Ozi ngwaahịa Micro SD kaadị njikọ push push,H1.85mm,A na-emekarị mechiri emechi ihe: Ụlọ:High okpomọkụ Thermoplastic,UL94V-0
Njikọ kaadị SIM, PUSH PUSH, 6P + 2P, H2.25mm, na-enweghị Post KLS1-SIM-030A
Ozi Ngwaahịa Njikọ Kaadị SIM,PUSH PUSH,6P+2P,H2.25mm,enweghị Post Ihe: Ụlọ:Hi-Temp Plastic,UL94V-0.Rated. Kọntaktị: Alloy ọla kọpa. Shell: igwe anaghị agba nchara.SUS 301,T=0.20mm. Plating: Mpaghara ana-akpọ:G/F Plated over 30u"Nickel Solder area:80u" Tin Plated over 30u" Nickel.N'okpuru efere:30u" Min Nickel. Shell:30u" Min,Nickel Plated Over All,SolderArea:Gold Flash. Eletriki: Rating ugbu a:0.5 A Dielectric na-eguzogide voltaji:...
Njikọ kaadị SIM, PUSH PUSH, 6P + 2P, H1.85mm, na-enweghị Post KLS1-SIM-030
Ozi Ngwaahịa Njikọ Kaadị SIM,PUSH PUSH,6P+2P,H1.85mm,enweghị Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Kọntaktị: Alloy ọla kọpa, T = 0.15mm; Shell: igwe anaghị agba nchara, T = 0.15mm Finsh: Terminal: 50u" min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u"Nickel Underplated on Allover,Gold Flash on Solder Latch. Eletriki: Ratin dị ugbu a...
Njikọ kaadị SIM 6P, PUSHPULL, H2.2mm H2.7mm H2.9mm KLS1-SIM-015
Ozi ngwaahịa 6P Njikọ Kaadị SIM, PUSH PULL, Roll Pack,H2.0mm,H2.2mm,H2.7mm,H2.9mm Ozi Usoro:KLS1-SIM-015-6P-H2.7Pins:6pins Height:H2.0mm,H2.2mm,H2.7mm,H2.9mm Materi Ebe obibi:Hi-Temp.Plastic,UL94V-0.Black. Ọnụ: Alloy ọla kọpa, (T=0.15mm),Edebere ọla edo n'elu Nickel. ndụdụ: Alloy ọla kọpa, (T = 0.20mm), Tin Plated N'elu Nickel. Eletrik: Ogo dị ugbu a:1.0 A max. Nguzogide kọntaktị: 30mΩ Max. Dielectric Voltage na-eguzogide: 500V AC RMS Maka Otu nkeji
Njikọ kaadị SIM; PUSH PULL, 6P+2P, H3.0mm KLS1-SIM-C727-2
Ozi Ngwaahịa Njikọ Kaadị SIM;PUSH PULL,6P+2P,H3.0mm,Mkpọ mpịakọta. Ihe: Isi: Hi Temp Thermoplastic, Black UL94V-0 mkpuchi: igwe anaghị agba nchara data kọntaktị: ọla kọpa Alloy, Gold plated mgba ọkụ Kọntaktị 1: ọla kọpa Alloy, Gold plated mgba ọkụ Kpọtụrụ 2: ọla kọpa Alloy, Gold plated General Characteristics Dimensions:15.85L*13.00H 0.78%% P0.2g Ogologo oge: 5000 okirikiri min. Njirimara Eletriki Nguzogide Kpọtụrụ:50mΩ ụdị 100mΩ Max. Na...
Ụdị njikọ njikọ kaadi SIM 6P,H1.9mm KLS1-SIM-019
Ozi ngwaahịa 6P SIM Kaadị njikọ njikọ ụdị, H1.9mm Ozi ịtụ:KLS1-SIM-019-6P-RPins:6pinsR= mpịakọta mpịakọta ihe: Housing: LCP, UL94V-0.Black. Ọnụ:C5210R-EH T=0.15mm Shell:SUS304R-1/2H,T=0.20mmOru okpomọkụ:-45ºC~+105ºC Nkebi No. Nkọwa PCS/CTN GW(KG) CMB(m3) OrderQty. Usoro oge
Ụdị njikọ njikọ kaadi SIM 6P,H1.8mm KLS1-SIM-018A
Ozi ngwaahịa 6P SIM Kaadị Njikọ Ụdị Hinged,H1.8mm Ozi Order:KLS1-SIM-018A-6P-H1.8-RPins:6pinsH1.8=Elu 1.8mmR=Mkpọ mkpọ NKE: 1.0 RATING. 1.1 voltaji:12 VAC (rms) 1.2 UGBUA: 1 AMPERES MAX. ÀMMADỤ NKE ELEKTIRI Kpọtụrụ Kọntaktị: 2.1 Nguzogide Kpọtụrụ: 60m? 2.2 Mkpuchi Mgbochi: 1000M? 2.3 DIELECTRIC NA-ECHICHE VOLTAGE: 500V AC maka nkeji 1 3.0 NDỤ ọrụ: 5000 CYCLES 4.0Operating Temperature:-45ºC~+105ºC...
6P
6P
6P & 8P SIM kaadị njikọ njikọ ụdị, H2.8mm KLS1-SIM-010
Ozi ngwaahịa 6P & 8P SIM Kaadị Njikọ Ụdị Hinged,H2.8mm Ozi Ozi:KLS1-SIM-010-6P-1-RPins:6pin,8pin0=Na peg 1=Enweghị pegR=Roll ngwugwu T=Tube ngwugwu ihe:Housing Material:LCP UL94V-0Contacta GoldContact Mpaghara: 100u "TinPackage: teepu na Reel Package Electrical Characteristics: Voltage Rating: 100V ACCurrent Rating: 3.0A Max na-eguzogide voltaji: 500V AC / 1MinuteInsulation resistance: ≥5000Μ&Omeg...
Ụdị njikọ njikọ kaadi SIM 6P & 8P,H2.5mm KLS1-SIM-010A
Ozi Ngwaahịa Ngwaahịa 6P & 8P SIM Kaadị Njikọ Ụdị Hinged,H2.5mm Ozi Usoro: KLS1-SIM-010A-H2.5-6P-1-R Pin:6pin,8pin 0=Na peg 1=Na-enweghị peg R=Roll Pack Ihe: Insulator ahụ:LCP. Agba: Onye kọntaktị ojii:Phosphor Bronze Plating: Ngwunye: Tin Gold ma ọ bụ Duplex plated. Standard:Gold flash 3u" niile Nickel Eletriki: Ugbu a Rating:0.5A. Dielectric Iguzogide voltaji:500V AC mkpuchi mkpuchi:1000MΩ Min Kpọtụrụ Nguzogide:30mΩ Max. Ndụ: 10000 Cy...- English
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