Njikọ Kaadị Micro SIM;PUSH PUSH,6P Ma ọ bụ 6P+1P,H1.35mm KLS1-SIM-069
Ozi ngwaahịa Micro SIM Njikọ Kaadị;PUSH PUSH,6P Ma ọ bụ 6P+1P,H1.35mm,Enweghị post. Ihe: Insulator: High TemperatureThermoplastic,UL94V-0 Kọntaktị:Copper Alloy,Plated 50U"NiOverall Kpọtụrụ Au 1U Shell:SUS,Plated 50U" Ni N'ozuzu Plated 1u"Au Nhọrọ Kọntaktị Mpaghara Eletriki: Ugbu a Rating: 0.5A Max.0. Kpọtụrụ ACVsistance1. Mgbochi mkpuchi:1000M Min./500VDC Ebe iru mmiri dị nso:95% RH Ma...
Njikọ kaadị SIM, PUSH PUSH, 6P, H1.85mm, na-enweghị Post KLS1-SIM-087
Ozi Ngwaahịa Njikọ Kaadị SIM, PUSH PUSH, 6P, H1.85mm, na-enweghị Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Kọntaktị: Alloy ọla, T = 0.15mm Shell: igwe anaghị agba nchara, T = 0.15mm Finsh: Terminal: 50u" min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u"Nickel Underplated on Allover,Gold Flash on Solder Latch. Eletriki: Ntụle ugbu a:0.5A. Voltage Rating:5.0 Vrms. Mkpuchi na-eguzogide...