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830 Point Solderless Breadboard na aluminom backplate KLS1-BB830C
830 Point solderless Breadboard na aluminom backplate KLS1-BB830C egosipụtara
  • 830 Point Solderless Breadboard na aluminom backplate KLS1-BB830C

830 Point Solderless Breadboard na aluminom backplate KLS1-BB830C

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830 Point Solderless Breadboard na aluminom backplate 830 Point Solderless Breadboard na aluminom backplate 830 Point Solderless Breadboard na aluminom backplate

Ozi ngwaahịa
Ọnụ 830Bọdụ achịcha etinyere na azụ azụ aluminom.
  • Oghere ngwụcha: 830
  • ihe: ABS plastic
  • Edemede njikọ: 3
  • Akụkụ: 183 x105mm
  • Ọ bịara na-acha ọcha maka ọdịdị ahụ dị ọcha (ọ bụghị uzo)
  • 3 akwụkwọ mmado
  • Ebe 1 ọdụ ụgbọ mmiri, 630 Tie-point
  • 2 eriri nkesa, 200 Tie-point
  • Bọọdụ achịcha 16.5 × 5.4 × 0.85 (cm)
  • Nchikota agba maka ntinye akụrụngwa dị mfe
  • Nabata nha waya dị iche iche (AWG:20-29)
  • Magburu onwe maka oru ngo DIY, prototyping na nnwale
  • Ozi ịtụ:
    KLS1-BB830C-01
    830: 830 isi
    Agba dị:Ọcha na nghọta




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